Basic Info.
Model NO.
MH
Condition
New
Certification
CE
Warranty
1 Year
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
>1,000,000 Shots
Transport Package
Wooden Case
Specification
280kg
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year
Product Description
Product Description
High-speed wire bonding machine
Ultra-quiet workbench, creating an excellent working environment
Fully enclosed workbench extends the service life of mechanical parts
Mass separation XY table suitable for light load and high speed occasions
The position is more precise, meeting the demanding requirements of 0.18μm process wafers
CT3100
Speed: 5 wires/second
1. updated from CT3100, XP operation system, digital camera import from German, 15% faster than CT3100.
2. Suit for small board bonding (quartz, watch, light, toys, LCM, etc. )
CT3000
Speed: 6 wires/second
Suit for high precession, super multi-wires products single IC (as card reader, U disk, digital camera, telephone etc.).
CT2300
Speed: 6 wires/second
Suit for high precession, super multi-wires products single IC (as card reader, U disk, digital camera, telephone etc.).
Shuttle 800B wire bonding machine
Fully enclosed copper wire gas protection device, anti-oxidation, low gas consumption;
The chip and the pins are reserved at the same time, which can handle the support with uneven pin distribution;
The high-resolution 1μm XY table ensures the accuracy of the equipment;
Friendly human-computer interaction, classified design parameter menu, simple and easy to learn.
Specification
Sample
Product details
Packing & Delivery 
To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
Our Factory
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment.
The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.
Frequently Asked Questions
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
2. About Sample:
We can provide sample production services for you, but you may provide some fees.
3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
High-speed wire bonding machine
Ultra-quiet workbench, creating an excellent working environment
Fully enclosed workbench extends the service life of mechanical parts
Mass separation XY table suitable for light load and high speed occasions
The position is more precise, meeting the demanding requirements of 0.18μm process wafers
CT3100
Speed: 5 wires/second
1. updated from CT3100, XP operation system, digital camera import from German, 15% faster than CT3100.
2. Suit for small board bonding (quartz, watch, light, toys, LCM, etc. )
CT3000
Speed: 6 wires/second
Suit for high precession, super multi-wires products single IC (as card reader, U disk, digital camera, telephone etc.).
CT2300
Speed: 6 wires/second
Suit for high precession, super multi-wires products single IC (as card reader, U disk, digital camera, telephone etc.).
Shuttle 800B wire bonding machine
Fully enclosed copper wire gas protection device, anti-oxidation, low gas consumption;
The chip and the pins are reserved at the same time, which can handle the support with uneven pin distribution;
The high-resolution 1μm XY table ensures the accuracy of the equipment;
Friendly human-computer interaction, classified design parameter menu, simple and easy to learn.
Specification | model | CT2300 | CT3000 | CT3100A |
| Z stroke | 0.4" | ||
| Resolution | 1μm | ||
| Wire feeding degree | 30° | 30° (45° optional) | |
| Wire diameter | 1.0-2.0 MIL | 0.8-2.0 MIL | 1.0-2.0 MIL |
| Bonding force | 15-80 gm | ||
| Bonding power | 0-2W adjustable | ||
| Bonding time | adjustable | ||
| Distance between | 4.8 mm | ||
| Bonding head and base | Work stage | ||
| XY stroke | 2"*2" | 2"*2" | 3"*3" |
| Rotary range | No limit | ||
| Base dimension | Max rotary R: 380mm | ||
| transducer | Light weight aluminum alloy | ||
| Process scan range XY | ±1mm (Magnification 3.5 times) | ||
| Process scan range rotary | ±15° | ||
| Optical system | 2.5X process control | ||
| Storage | Up to 99 programs, up to 1000 COB chips per program, up to 1000 lines per chip | ||
| Voltage | 2 phase 220V | ||
| Frequency | 50/60 HZ | ||
| Power | 800W | ||
| weight | 240kg | 270kg | 280kg |
| size | 1050*750*1400mm | 630*700*1350mm | 750*1050*1450mm |
| Bonding speed | 50ms/wire for 2mm |
| Bonding accuracy | ±3.0 μm |
| Wire length | Max.8mm |
| Wire diameter | 15-50μm |
| Wire type | Au, Ag, Alloy, CuPd, Cu |
| Bond type | Single line /BSOB/BBOS |
| Loop control | Support ultra-low arc |
| Bonding area | 56mm*65mm |
| XY resolution | 0.1μm |
| Transducer system | 138kHZ |
| PR accuracy | ±0.37μm,±0.74μm |
| Applicable magazine | 120-305*45-98*50-180mm |
| Magazine pitch | Min 1.5mm |
| Applicable lead frame | 100-300*40-90*0.1-1.3mm |
| Different lead frame | <5min |
| Same lead frame | <15min |
| Operation interface | <4min |
| Overall dimension | Chinese/English |
| volume | 950mm*920*1850mm |
| Weight | 750kg |
| Voltage | 190~240V |
| Frequency | 50HZ |
| Compressed air | 0.6-0.97bar |
| Air consumtion | 80L/min |
Product details 
Packing & Delivery 
Our Factory
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment.
The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.
Frequently Asked Questions
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
2. About Sample:
We can provide sample production services for you, but you may provide some fees.
3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.